Joining of TiAl using a thin multilayer

• Type: Article in International Scientific Journal
• Date: 2006

Authors

Duarte, LI (Author) Other; Ramos, AS (Author) Other; Vieira, MF (Author) FEUP; Viana, F (Author) FEUP; Vieira, MT (Author) Other

Journal

The Journal is awaiting validation by the Administrative Services.

Title: ADVANCED MATERIALS FORUM III, PTS 1 AND 2

Vol. 15

Pages: 1323-1327

Indexing

ISI Web of Knowledge - 5 Citations

Scopus - 6 Citations

Scientific classification

FOS: Engineering and technology > Materials engineering

CORDIS: Technological sciences > Engineering > Materials engineering

Other information

Authenticus ID: P-004-P03

DOI: 10.4028/www.scientific.net/msf.514-516.1323

Abstract (EN): As TiAl based alloys begin to approach maturity, the development of successful and cost effective joining methods will be required. The growing industrial interest in these materials, particularly in aerospace and automotive industry, led to an interesting challenge - how to joint parts and components in order to produce integrated and resistant structures. Diffusion bonding of materials produces components with thinner interfaces than other joining techniques do. The absence of abrupt microstructure discontinuity and the small deformation induced maximize joint strength. This work focuses on the joining of TiAl using a thin multilayer obtained by alternating nanometric layers of titanium and aluminium. The Ti/Al layers were deposited onto the gamma-TiAl samples by DC magnetron sputtering. The inter-faces of these diffusion bonded joints depend on processing and deposition conditions. In this work we describe the influence of bilayer thickness (period) and on microstructure and chemical composition of the joining interfaces.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 5