Electrodeposition of Mn and Mn-Sn Alloy Using Choline Chloride-Based Ionic Liquids

• Type: Article in International Scientific Journal
• Date: 2017

Authors

Nuno Pereira (Author) FCUP; Carlos M Pereira (Author) FCUP; araujo, j. p. (Author) FCUP; Silva, F (Author) FCUP

Journal

Title: Journal of the Electrochemical Society

Vol. 164 No. 2

Pages: D486-D492

ISSN: 0013-4651

Publisher: Electrochemical Society, Inc.

Indexing

ISI Web of Knowledge - 7 Citations

Scopus - 8 Citations

Other information

Authenticus ID: P-00R-3HE

DOI: 10.1149/2.1421707jes

Abstract (EN): The deposition of Mn and Mn-Sn alloy from two deep eutectic solvents (DES) was investigated. Pure Mn deposits were powdery and amorphous regardless the DES used. In contrast, the manganese-tin deposits obtained from the two DES used were adherent. The morphology of the deposits obtained from the different DES was analyzed by SEM, which showed that pure Mn films were fibrous. The morphology of Mn-Sn deposits changed upon changing on the amount of tin in solution or the DES used. The phase composition of the Mn-Sn films were investigated by X-Ray diffraction, which showed that the deposits were formed by different MnxSny intermetallic phases. The metallic content in the deposit changed upon changing the bath composition or the DES used. Using the urea (U) based DES Mn-Sn deposits with a Sn content between 1.8 and 6.7 wt% were obtained. In contrast, using the ethylene glycol (EG) based DES the Sn content in the deposits varied between 33.2 and 59.0 wt%.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 7