Microstructural characterisation of y-TiAl joints

• Type: Article in International Scientific Journal
• Date: 2002

Authors

Guedes, A (Author) Other; Pinto, AMP (Author) Other; Vieira, M (Author) FEUP; Viana, F (Author) FEUP; Ramos, AS (Author) Other; Vieira, MT (Author) Other

Journal

Title: Advanced Materials Forum I

Vol. 587-588

Pages: 27-30

Publisher: Trans Tech Publications

Indexing

ISI Web of Knowledge - 7 Citations

Scopus - 9 Citations

Scientific classification

FOS: Engineering and technology > Materials engineering

Other information

Authenticus ID: P-000-QNH

DOI: 10.4028/www.scientific.net/kem.230-232.27

Abstract (EN): The joining of a gamma-TiAl alloy using Incusil-ABA as filler metal was investigated. Bonding was performed in a high vacuum furnace at 750 degreesC for 10 min. The interfacial microstructure was analysed by SEM and its composition was investigated by EDS. An intense diffusion of Ti and Al to the interface and a strong reaction between the braze alloy and the base metal were observed. The interface could be divided into two distinct zones: (1) the reaction layer located near the base metal, essentially composed of Cu-Al-Ti compounds and (2) the central zone of the interface that corresponds to an (Ag) solid solution in which Cu-Al-Ti compounds are dispersed.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 4