Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

• Type: Article in International Scientific Journal
• Date: 2000

Authors

R. Martins (Author) Other; J. Ferreira (Author) Other; C. Gonçalves (Author) Other; P. Nunes (Author) Other; E. Fortunato (Author) Other; A. P. Marvão (Author) Other; José Inácio Martins (Author) FEUP

Journal

The Journal is awaiting validation by the Administrative Services.

Title: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Vol. 288 No. 2

Pages: 275-279

ISSN: 0921-5093

Indexing

ISI Web of Knowledge - 0 Citations

ISI Web of Science

Scopus - 1 Citation

Other information

Authenticus ID: P-000-YZM

DOI: 10.1016/s0921-5093(00)00871-6

Abstract (EN): Results are presented on the electrical characteristics of power diodes soldered using new lead-free techniques based on Cu-Sn-Cu joints. Special emphasis is put on the role of the thickness of the Cu films electrodeposited on the electrical performances of the power diodes joined and to study the electrical stability of the joints formed, under extreme aggressive conditions.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 5