Influence of void damage on the electromechanical impedance spectra of Single Lap Joints

• Type: Article in International Scientific Journal
• Date: 2023

Authors

Tenreiro, AFG (Author) Other; António Mendes Lopes (Author) FEUP; da Silva, LFM (Author) Other; Ricardo Carbas (Author) FEUP

Journal

Title: NDT & E International

Vol. 138

ISSN: 0963-8695

Publisher: Elsevier

Indexing

ISI Web of Knowledge - 0 Citations

Scopus - 0 Citations

Other information

Authenticus ID: P-00Y-B9X

DOI: 10.1016/j.ndteint.2023.102865

Abstract (EN): Adhesively bonded joints are susceptible to a variety of damage sources, which may be of difficult detection with current Non-Destructive Testing (NDT) methods. Structural Health Monitoring (SHM) techniques, such as the Electromechanical Impedance Spectroscopy (EMIS), aims to outpace NDT by continuously monitoring structures for defects. However, given the complexity of adhesive joint structures, EMIS capability for damage detection still needs to be thoroughly studied. In this manner, electrical impedance measurements were done to Single Lap Joints (SLJ), with both a modified epoxy adhesive and Pressure Sensitive Adhesive (PSA) for void detection. Void defects could not be detected on adhesive joints with the PSA but, in the case of joints with the modified epoxy adhesive, impedance signatures were significantly altered by the presence of both the artificially created void, and by a second damage source caused during the SLJ manufacture. Experimental measurements from modified epoxy joints were compared with simulation results, yielding good approximation when considering the effect of the second source of damage. An approximation of the mechanical impedance was also computed using numerical results from the pristine SLJ model. In this manner, it is possible to detect damage in the adhesive layer of SLJs with electrical impedance measurements from EMIS.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 15