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TEM and HRTEM Characterization of TiAl Diffusion Bonds Using Ni/Al Nanolayers

Title
TEM and HRTEM Characterization of TiAl Diffusion Bonds Using Ni/Al Nanolayers
Type
Article in International Scientific Journal
Year
2015
Authors
Ana S Ramos
(Author)
Other
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Maria T Vieira
(Author)
Other
The person does not belong to the institution. The person does not belong to the institution. The person does not belong to the institution. Without AUTHENTICUS Without ORCID
Journal
Vol. 21 No. 1
Pages: 132-139
ISSN: 1431-9276
Scientific classification
FOS: Engineering and technology > Materials engineering
CORDIS: Technological sciences > Engineering > Materials engineering
Other information
Authenticus ID: P-00A-ANH
Abstract (EN): Diffusion bonding of TiAl alloys can be enhanced by the use of reactive nanolayer thin films as interlayers. Using these interlayers, it is possible to reduce the conventional bonding conditions (temperature, time, and pressure) and obtain sound and reliable joints. The microstructural characterization of the diffusion bond interfaces is a fundamental step toward understanding and identifying the bonding mechanisms and relating them to the strength of the joints. The interface of TiAl samples joined using Ni/Al nanolayers was characterized by transmission electron microscopy and scanning transmission electron microscopy. Microstructural characterization of the bond revealed that the interfaces consist of several thin layers of different composition and grain size (nanometric and micrometric). The bonding temperature (800, 900, or 1,000 degrees C) determines the grain size and thickness of the layers present at the interface. Phase identification by high-resolution transmission electron microscopy combined with fast Fourier transform and electron energy-loss spectroscopy analyses reveals the presence of several intermetallic compounds: AlTiNi, NiAl, and Al2TiNi. For bonds produced at 800 and 900 degrees C, nanometric grains of Ti were detected at the center of the interface.
Language: English
Type (Professor's evaluation): Scientific
No. of pages: 8
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