Effects of Temperature and Loading Rate on the Mechanical Properties of a High Temperature Epoxy Adhesive

• Type: Article in International Scientific Journal
• Date: 2011

Authors

Banea, MD (Author) FEUP; de Sousa, FSM (Author) Other; da Silva, LFM (Author) FEUP; Campilho, RDSG (Author) Other; de Bastos Pereira, AMD (Author) Other

Journal

Title: Journal of Adhesion Science and Technology

Vol. 25

Pages: 2461-2474

ISSN: 0169-4243

Publisher: Taylor & Francis

Indexing

ISI Web of Knowledge - 94 Citations

Scopus - 118 Citations

Scientific classification

FOS: Engineering and technology > Chemical engineering

Other information

Authenticus ID: P-002-X3H

DOI: 10.1163/016942411x580144

Abstract (EN): The variation of the mechanical properties of adhesives with temperature and strain rate is one of the most important factors to consider when designing a bonded joint due to the polymeric nature of adhesives. It is well known that adhesive strength generally shows temperature dependence. Moreover, in many structural applications, the applied loads can be dynamic and the design of the joint requires the knowledge of the high loading rate mechanical behaviour of the adhesive. In this study, the combined effect of the temperature and test speed on the tensile properties of a high temperature epoxy adhesive was investigated. Tensile tests were performed at three different test speeds and various temperatures (room temperature (RT) and high temperatures (100, 125 and 150 degrees C)). The glass transition temperature (T(g)) of the epoxy adhesive investigated is approximately 155 degrees C. The ultimate tensile stress decreased linearly with temperature (T) while increased logarithmically with the loading rate, which is in the accord with the Airing's molecular activation model. (C) Koninklijke Brill NV, Leiden, 2011

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 14