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Void detection in bonded joints with computed damage metrics from Electromechanical impedance spectra

Title
Void detection in bonded joints with computed damage metrics from Electromechanical impedance spectra
Type
Summary of Presentation in an International Conference
Year
2023
Authors
A.F.G. Tenreiro
(Author)
Other
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António Mendes Lopes
(Author)
FEUP
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da Silva, LFM
(Author)
FEUP
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Type (Professor's evaluation): Scientific
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