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Void detection in adhesive single lap joints through electromechanical impedance spectrum

Title
Void detection in adhesive single lap joints through electromechanical impedance spectrum
Type
Summary of Presentation in an International Conference
Year
2023
Authors
AFG Tenreiro
(Author)
Other
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António Mendes Lopes
(Author)
FEUP
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da Silva, LFM
(Author)
FEUP
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Type (Professor's evaluation): Scientific
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