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Void detection in adhesive joints through electromechanical impedance signatures

Title
Void detection in adhesive joints through electromechanical impedance signatures
Type
Summary of Presentation in an International Conference
Year
2022
Authors
AFG Tenreiro
(Author)
Other
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António Mendes Lopes
(Author)
FEUP
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da Silva, LFM
(Author)
FEUP
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Other information
Type (Professor's evaluation): Scientific
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