Abstract (EN):
Structural adhesive joints are susceptible to many forms of damage that may not be detectable with currently deployed Non-Destructive Tests (NDT). The Electromechanical Impedance Spectroscopy (EMIS) based Structural Health Monitoring (SHM) methodology constitutes an alternative, where a given structure is continuously monitored for damage, thus outperforming NDT. While much has been done in the applicability of EMIS in metallic and composite structures, only preliminary research has been done on the EMIS-based integrity monitoring of adhesive joints. In this paper, two different k-Nearest Neighbor (kNN) approaches are used for both damage detection and damage quantification. Initially, peaks are extracted from the real component of the measured impedance of instrumented adhesive joint specimina, which are then inputted to either a conventional kNN or a novel parallel kNN model, where each individual model is fed with its respective peak information. For void detection, the parallel classifier approach presents a moderately better performance, with an average accuracy of 98% under optimal conditions, but, for damage quantification, a significant improvement in classification is observed. In all cases, the use of the Canberra distance allows for a significant increase in classification accuracy.
Language:
English
Type (Professor's evaluation):
Scientific
No. of pages:
18