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New adhesion process based in lead free solder applied in electronic power devices
Title
New adhesion process based in lead free solder applied in electronic power devices
Type
Article in International Scientific Journal
Year
2002
Authors
H. Seiroco
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M. Vicente
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J. Ferreira
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Francisco B. Fernandes
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A. P. Marvão
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J.I. Martins
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FEUP
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E. Fortunato
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R. Martins
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Language:
Portuguese
Type (Professor's evaluation):
Scientific
No. of pages:
4
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