A study of the fracture mechanisms of hybrid carbon fiber reinforced polymer laminates reinforced by thin-ply

• Type: Article in International Scientific Journal
• Date: 2022

Authors

Ramezani, F (Author) Other; Ricardo Carbas (Author) FEUP; Marques, EAS (Author) FEUP; Ferreira, AM (Author) FEUP; da Silva, LFM (Author) Other

Journal

Title: Polymer Composites

Vol. 44

Pages: 1672-1683

ISSN: 0272-8397

Publisher: Wiley-Blackwell

Indexing

ISI Web of Knowledge - 0 Citations

Scopus

Other information

Authenticus ID: P-00X-NJF

DOI: 10.1002/pc.27196

Abstract (EN): The main stress component which creates delamination in bonded single lap joints with composite adherends is the transverse tensile stress. Therefore, the following study investigates the behavior of composite laminates (reference and hybrid laminates reinforced by thin-ply) under transverse tensile loading. Texipreg HS 160T700 and NTPT-TP415 were used as the conventional carbon fiber reinforced polymer (CFRP) and thin-ply respectively. Hybrid composite laminates were studied using different amounts of thin-ply, applied through the thickness. The manufactured laminates, of unidirectionally stacked construction, were tested under transverse tensile loading. Digital image correlation was performed to investigate the average peel strain distribution for the composite and to better understand the phenomena associated to the use of hybrid laminates. Experimental results show that the reinforced hybrid composite laminates, created using thin-plies, present higher failure load compared to the reference conventional CFRP or thin-ply laminates. This was found to be due to the higher ductility enabled by the presence of thin-plies. Distributing a constant amount of thin-ply through the thickness was found to increase the laminate transverse strength, as the thin-ply laminates act as a barrier against crack propagation. A representative volume element was studied for each configuration since this numerical method brings the opportunity to investigate the studied configurations in microscale.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 12