Manufacture of adhesive joints and bulk specimens with high-temperature adhesives

• Type: Article in International Scientific Journal
• Date: 2004

Authors

Lucas F. M. da Silva (Author) FEUP; R. D. Adams (Author) Other; M. Gibbs (Author) Other

Journal

Title: International Journal of Adhesion and Adhesives

Vol. 24 No. 1

Pages: 69-83

ISSN: 0143-7496

Publisher: Elsevier

Indexing

ISI Web of Knowledge - 64 Citations

Scopus - 129 Citations

Scientific classification

FOS: Engineering and technology > Chemical engineering

Other information

Authenticus ID: P-00F-H25

DOI: 10.1016/s0143-7496(03)00101-5

Abstract (EN): For high-temperature usage (200°C and above) such as in certain supersonic aircraft structures, the adhesives used are either bismaleimides or polyimides, generally supplied as films, with or without a carrier. Other adhesives, such as modified epoxies, can also be used up to 200°C. For simulation purposes (such as finite element analysis), the adhesive mechanical properties are needed. These are generally obtained by testing a bulk specimen in tension or by testing adhesive joints under pure shear. However, a problem associated with adhesive films is void formation during manufacture. In order to achieve the full potential of the adhesive, it is necessary to understand the origin of the voids and to develop techniques to eliminate or minimise their formation. In this investigation, a bismaleimide adhesive, Redux 326 (Hexcel Composites), was studied in two forms: supported (woven glass) film and paste. Different manufacturing methods such as the vacuum release technique and sheet moulding were tested in order to produce adhesive joints and bulk specimens free of defects. The merits of each technique are discussed in terms of efficiency and practicability. The most appropriate method was used to manufacture single lap joints with and without voids in the supported film and paste form. These were tested at low temperatures where the adhesive is brittle and at high temperatures where the adhesive is ductile, to check the influence of voids and the carrier in the joint strength.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 15