The Effect of Complex Agents on the Electrodeposition of Tin from Deep Eutectic Solvents

• Type: Article in International Scientific Journal
• Date: 2012

Authors

Nuno M Pereira (Author) Other; Carlos M Pereira (Author) FCUP; Fernando Silva, AF (Author) FCUP

Journal

Title: ECS Electrochemistry Letters

Vol. 1

Pages: D5-D7

ISSN: 2162-8726

Publisher: The Electrochemical Society

Indexing

ISI Web of Knowledge - 18 Citations

ISI Web of Science

Scopus - 17 Citations

Scientific classification

FOS: Engineering and technology > Materials engineering

Other information

Authenticus ID: P-005-413

DOI: 10.1149/2.003202eel

Abstract (EN): The use of additives for the electrodeposition from deep eutectic solvents is still an unexplored area however of the upmost importance to understand the role of additives in metal electrodeposition in new media such as DES. In this study we describe the effect of three additives with complexing properties and their effect on the voltammetric profile of tin and the deposit morphology. It is shown that EDTA and HEDTA do not alter the voltammetric profile of tin. In contrast the addition of Idranal VII has a pronounced effect the voltammetric behavior of tin and in the tin deposit morphology.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 3