Application of 3D electronic speckle pattern interferometry for the analysis of thermal response in printed circuit boards

• Type: Article in International Conference Proceedings Book
• Date: 2019-09-02

Authors

Mário Vaz (Author) FEUP

Conference proceedings International

Title: 3RD INTERNATIONAL CONFERENCE ON STRUCTURAL INTEGRITY (ICSI 2019)

Pages: 835-842

3rd International Conference on Structural Integrity (ICSI)

Funchal, PORTUGAL, SEP 02-05, 2019

Indexing

ISI Web of Knowledge - 3 Citations

Scopus - 5 Citations

Other information

Authenticus ID: P-00R-92N

DOI: 10.1016/j.prostr.2019.08.111

Abstract (EN): The present work reports the development of a method for measurement of sub-micrometer displacements due to the thermal response of printed circuit boards. The developed system employs Electronic Speckle Pattern Interferometry in three dimensions, obtaining three orthogonal displacements of the specimen's surface from the resulting phase maps. Afterwards, the displacements are corrected, removing the rigid rotation of the physical support and the relative rotation between the two regions of interest is calculated. This method provides a very high-resolution displacement measurement tool, which is very important, for example, in the design phase of outdoor surveillance cameras to optimize image quality. (C) 2019 The Authors. Published by Elsevier B.V.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 8