A wet dismantling process for the recycling of computer printed circuit boards

• Type: Article in International Scientific Journal
• Date: 2018-01-18

Authors

Sílvia Pinho (Author) FEUP; Marco Ferreira (Author) Other; Manuel F. Almeida (Author) FEUP

Journal

Title: Resources, Conservation and Recycling

Vol. 132

Pages: 71-76

ISSN: 0921-3449

Publisher: Elsevier

Indexing

ISI Web of Knowledge - 5 Citations

Scopus - 21 Citations

INSPEC

Associated Projects

LEPABE-2-ECO-INNOVATION - LEPABE-2-ECO-INNOVATION

LEPABE - Laboratório de Engenharia de Processos, Ambiente, Biotecnologia e Energia

Other information

Authenticus ID: P-00N-K5G

DOI: 10.1016/j.resconrec.2018.01.022

Abstract (EN): In this research a new process for dismantling the components of the waste printed circuit boards (WPCBs) was developed. This process uses water and aqueous solutions of sodium hydroxide at conditions above solder melting temperatures which not only prevents pollution problems, but also separates the multilayers of WPCBs. The results show that removal of components in the WPCBs was achieved at 280 degrees C for 15 min with a 1 M NaOH solution. At these conditions glass fiber, epoxy resin and copper layers were separated and the resultant solution showed low concentration of copper, zinc, lead and iron ranging from 23 to 43 mg/kg of WPCBs and high concentration of tin and aluminium of 8 g/kg and 61 g/kg of WPCBs, respectively. About 97% of tin and 99% of aluminium in this solution were removed by precipitation.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 6