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THE RESIDUAL STRESSES ON MECHANICAL PROPERTIES OF COPPER THIN FILMS
Title
THE RESIDUAL STRESSES ON MECHANICAL PROPERTIES OF COPPER THIN FILMS
Type
Article in International Conference Proceedings Book
Year
2012
Authors
Fernandes, CM
(Author)
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Vieira, MF
(Author)
FEUP
Vieira, MT
(Author)
Other
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Conference proceedings International
Title:
Proceedings ICEM15 - 15th International Conference on Experimental Mechanics
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ICEM15 - 15th International Conference on Experimental Mechanics
Porto, 22-27 July 2012
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Authenticus ID:
P-005-K3Y
Abstract (EN):
The present work investigates the impact of copper thin films residual stresses on mechanical properties values, namely hardness and tensile strength. Stress state from -1.4 to 0 GPa were discernible in copper thin films sputter-deposited on polyester (PET-Mylar) substrates. Whatever the stress state just a slight variation on mechanical properties has been noticed in the different thin films.
Language:
English
Type (Professor's evaluation):
Scientific
No. of pages:
4
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