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Signal integrity and interconnections test on technical fabrics

Title
Signal integrity and interconnections test on technical fabrics
Type
Article in International Conference Proceedings Book
Year
2012
Authors
Zambrano, A
(Author)
Other
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José Machado da Silva
(Author)
FEUP
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Conference proceedings International
Pages: 79-84
2012 IEEE 18th International Mixed-Signal, Sensors, and Systems Test Workshop, IMS3TW 2012
Taipei, 14 May 2012 through 16 May 2012
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Authenticus ID: P-008-734
Abstract (EN): The use of textile yarns as data transmission media enables the design of non-obtrusive well-fitting garments as wearable systems. However, textile conductive yarns show impedances higher than those presented by common metal conductors and these values can change with the textile condition and level of stretching, affecting the integrity of the transmitted signal. This work proposes a built-in self-test methodology to test textile yarn interconnections for conventional stuck-at, open and short faults, as well as to verify signal integrity. The test procedure being proposed relies on sampling to generate a digital signal that results from comparing the received signal with pre-defined voltage levels. The obtained signature allows to verify signal integrity parameters: VLmax, VHmin and rise and fall times. Simulation results confirm the validity of the methodology being proposed. © 2012 IEEE.
Language: English
Type (Professor's evaluation): Scientific
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