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Cold rolled versus sputtered Ni/Ti multilayers for reaction-assisted diffusion bonding

Title
Cold rolled versus sputtered Ni/Ti multilayers for reaction-assisted diffusion bonding
Type
Article in International Scientific Journal
Year
2016
Authors
Emadinia, O
(Author)
Other
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Cavaleiro, AJ
(Author)
Other
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Ramos, AS
(Author)
Other
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Vieira, MT
(Author)
Other
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Journal
Vol. 60
Pages: 337-344
ISSN: 0043-2288
Publisher: Springer Nature
Other information
Authenticus ID: P-00K-04T
Abstract (EN): Reaction-assisted diffusion bonding of TiNi to Ti6Al4V was carried out using two types of filler materials: (i) Ni/Ti multilayer foils produced by accumulative roll bonding (ARB) and (ii) Ni/Ti multilayer thin films prepared by magnetron sputtering. In ARB, nanostructures were produced through severe plastic deformation by stacking alternated Ni and Ti foils and rolling at a strain rate of 20 s(-1) up to 16 cycles, attaining a total thickness close to 300 mu m. Using ARB Ni/Ti ultrafine multilayers, it was possible to achieve sound joints at undemanding conditions for a solid-state joining process (800 degrees C/10 MPa/60 min), with a shear strength of 35 MPa. The layered structure of the foil transforms into TiNi with small regions of Ti2Ni and TiNi3; a continuous layer of Ti2Ni is observed close to the Ti6Al4V base material. Ni/Ti multi-layer thin films with nanometric modulation periods have also been successfully used to produce sound joints at 750 and 800 degrees C, under 10 or 50 MPa during 60 min, with a shear strength of 88 MPa. The interface is very thin (less than 10 mu m) and exhibits several zones; comprising a Ti2Ni layer close to the Ti6Al4V alloy, followed by TiNi and Ti2Ni phases.
Language: English
Type (Professor's evaluation): Scientific
No. of pages: 8
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