The failure analysis and lifetime prediction for the solder joint of the magnetic head

• Type: Article in International Scientific Journal
• Date: 2015

Authors

Xianghui H Xiao (Author) Other; Minfang F Peng (Author) Other; Jaime S Cardoso (Author) FEUP; Rongjun J Tang (Author) Other; YingLiang L Zhou (Author) Other

Journal

Title: Applied Physics A: Materials Science and Processing

Vol. 118

Pages: 691-697

ISSN: 0947-8396

Publisher: Springer Nature

Indexing

ISI Web of Knowledge - 0 Citations

Scopus - 0 Citations

Scientific classification

FOS: Engineering and technology > Materials engineering

Other information

Authenticus ID: P-00A-68T

DOI: 10.1007/s00339-014-8781-9

Abstract (EN): Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 A degrees C is 0.015354; the solder lifetime t is 14.46 years .

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 7