Publications

M. Silva Jr., A.S. Ramos, F. Viana, M.T. Vieira, M.F. Vieira, S. Simões. "The use of Ni/Al nanolayers in the diffusion bonding of Ti6Al4V to Al2O3" AJP 2019, 1st International Conference on Advanced Joining Processes, 24-25 October, Ponta Delgada, Azores, Portugal, 2019

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Materiais 19 poster_ssimoes		7442.96 KB

Simoes, S (Author) (FEUP); M. Silva Jr (Author) (Other); A. S. Ramos (Author) (Other); M. T. Vieira (Author) (Other); Vieira, MF (Author) (FEUP); Filomena Viana (Author) (FEUP)

2019

M. Silva Jr., A.S. Ramos, F. Viana, M.T. Vieira, M.F. Vieira, S. Simões. "Diffusion bonding of Ti6Al4V to Al2O3 using reactive nano layers" EUROMAT 2019, 1-5 September, Stockholm, Sweden, 2019

File name	Description	Size
AJN 2019 poster_rev I		1705.77 KB

Simoes, S (Author) (FEUP); M. Silva Jr (Author) (Other); A.S. Ramos (Author) (Other); M.T. Vieira (Author) (Other); Vieira, MF (Author) (FEUP); Filomena Viana (Author) (FEUP)

2019

Thermal stability of nanocrystalline copper thin films

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Poster_Euromat_2019_AS_Ramos		1709.85 KB

Another Publication in an International Scientific Journal

Simoes, S (Author) (FEUP); Calinas, R (Author) (Other); Ferreira, PJ (Author) (Other); Viana, F (Author) (FEUP); Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2007

TEM and SEM in-situ annealing of nanocrystalline copper thin films

Simoes, S (Author) (FEUP); Calinas, R (Author) (Other); Ferreira, PJ (Author) (Other); Viana, F (Author) (FEUP); Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2008

Ni/Ti and Ni/Al Laminated Composites Produced by ARB and Annealing: Microstructural Aspects

Emadinia, O (Author) (Other); Simões, S (Author) (FEUP); Viana, F (Author) (FEUP); Vieira, MF (Author) (FEUP)

2015

Microstructural Characterization of CNT/Al Nanocomposites Produced by Hot Extrusion

Simões, S (Author) (FEUP); Cruz, S (Author) (Other); Rey, P (Author) (Other); Viana, F (Author) (FEUP); Vieira, MF (Author) (FEUP)

2015

Joining of TiAl alloys using Ni/Al multilayers

Simoes, S (Author) (FEUP); Viana, F (Author) (FEUP); Ventzke, V (Author) (Other); Kocak, M (Author) (Other); Ramos, AS (Author) (Other); Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2009

Intermixing in Ni/Al multilayer thin films

Simoes, S (Author) (FEUP); Viana, F (Author) (FEUP); Ramos, AS (Author) (Other); Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2009

In-situ TEM annealing of nanocrystalline copper thin films

Simoes, S (Author) (FEUP); Calinas, R (Author) (Other); Ferreira, PJ (Author) (Other); Viana, F (Author) (FEUP); Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2007

Effect of functionalization and size of CNTs in the production of nanocomposites

Simoes, S (Author) (FEUP); Ferreira, PJ (Author) (Other); Filomena Viana (Author) (FEUP); Reis, MAL (Author) (Other); Vieira, MF (Author) (FEUP)

2017

Effect of dispersion method in the production of Al-CNTs nanocomposites

Simoes, S (Author) (FEUP); Filomena Viana (Author) (FEUP); Reis, MAL (Author) (Other); Vieira, MF (Author) (FEUP)

2016

Characterization of TiAl diffusion bonds using Ni/Ti nanolayers

Simoes, S (Author) (FEUP); Filomena Viana (Author) (FEUP); Ramos, AS (Author) (Other); Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2016

Characterization of Ni/Ti interlayer foil to assist diffusion bonding

Emadinia, O (Author) (Other); Simões, S (Author) (FEUP); Filomena Viana (Author) (FEUP); Vieira, MF (Author) (FEUP)

2015

Joining Technology of ¿-TiAl Alloys

Book

Simoes, S (Author) (FEUP); Filomena Viana (Author) (FEUP); Vieira, MF (Author) (FEUP)

2017

Effect of Annealing Conditions in Nanocrystalline Copper Thin Film

Summary of Presentation in an International Conference

S. Simões (Author) (FEUP); R. Calinas (Author) (FEUP); P. J. Ferreira (Author) (FEUP); M. T. Vieira (Author) (FEUP); F. Viana (Author) (FEUP); M. F. Vieira (Author) (FEUP)

2007

Scientific classification

A.S. Ramos, A.J. Cavaleiro, E. Hodulova, S. Simões, F. Viana, M.F. Vieira, J. Morgiel, M.T. Vieira. “Advanced Research in Reactive Multilayer Thin Films for Joining Applications”, 6th Intermediate meeting of International Institute of Welding commission XVII “Brazing, diffusion bonding and soldering". Trnava (Eslováquia), 8-9 October 2018.

Simoes, S (Author) (FEUP); Vieira, MF (Author) (FEUP); Filomena Viana (Author) (FEUP); A. S. Ramos (Author) (Other); M. T. Vieira (Author) (Other); A.J. Cavaleiro (Author) (Other); E. Hodulova (Author) (Other); J. Morgiel (Author) (Other)

2018

Carbon Nanotubes and Their Nanocomposites

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APRES_Intermediate Meeting Commi ssion XVII_Trnava_OUT2018_1º e último slide		697.63 KB

Chapter or Part of a Book

Simoes, S (Author) (FEUP); Filomena Viana (Author) (FEUP); Vieira, MF (Author) (FEUP)

2016

TiAl diffusion bonding using Ni/Ti multilayers

Article in International Scientific Journal

Simoes, S (Author) (FEUP); Sofia Ramos, AS (Author) (Other); Filomena Viana (Author) (FEUP); Teresa Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2017

TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film

Simoes, S (Author) (FEUP); Viana, F (Author) (FEUP); Ramos, AS (Author) (Other); Vieira, MT (Author) (Other); Vieira, MF (Author) (FEUP)

2010